[Ronja] electronics newbie question
Karel Kulhavy
twibright at hispeed.ch
Sat Mar 15 11:32:54 GMT 2008
---- "Gyurkó Martin" <asteri_x at freemail.hu> schrieb:
> Through hole pins:
DIP = Dual in line through hole pins
DIL = DIP
SMD devices are all the other:
SOIC = A Small-Outline Integrated Circuit
TSSOP = Thin-Shrink Small Outline Package
BGA = Ball grid array
DIL/DIP means the wires are stuck into holes in a board. SMD means the device is just
laid down on the board without any holes and soldered directly to the traces.
CL<
bye,
Martin
Karel Kulhavy írta:
> ---- Deepak Mishra <xask.linus at gmail.com> schrieb:
>> Hi,
>>
>> While checking for the availability of the RONJA components, I got confused
>> a bit
>> I was looking for the 74xxxx,
>>
>> the packaging mentioned "DIP", "SOIC" but NOT "SMD" as in the RONJA part
>> list.
>>
>> IS SOIC the same as SMD. They seem like the same thing
>>
>> can I use the SOIC packaged ICs on the PCB listed at the website.
>
> Yes. I should change it in the partlists.
>
> CL<
>> Regards,
>> Deepak
>
>
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